Gold-Plated SIM Card Contact Chip (Micro-Scale)
Electronic Component (E-Waste Scrap) · Yellow Gold plating over nickel and copper-alloy substrate.
Purity: 24K Gold Plated (~99.9% Purity Plating over Base Metal). Plating thickness typically ranges from 0.03 to 0.1 microns.
Type
Electronic Component (E-Waste Scrap)
Purity
24K Gold Plated (~99.9% Purity Plating over Base Metal). Plating thickness typically ranges from 0.03 to 0.1 microns.
Gold Type
Yellow Gold plating over nickel and copper-alloy substrate.
Weight
Total weight ~0.05 grams; Gold content estimated at <0.001 grams.
Description
This is a detached microprocessor contact plate from a mobile SIM (Subscriber Identity Module) card. While it features a thin layer of gold for electrical conductivity and corrosion resistance, it is an industrial component rather than jewelry or bullion. The gold is electroplated over a base metal frame which connects to a silicon chip on the reverse.
Key Features
Planar contact layout with isolated electrical zones; yellow metallic coloration; standard ISO/IEC 7816-2 contact patterns.
Color & Finish
Dull yellow metallic hue with a satin, semi-matte finish typical of industrial electroplating; displays scratch patterns from contact insertion.
Hallmarks & Stamps
None. Industrial components carry no precious metal hallmarks.
Dimensions Estimate
Approximately 12mm x 9mm (standard nano/micro SIM chip surface area).
Gemstones & Inlays
None. Functional silicon wafer and resin bonding on reverse side.
Clasp & Closure
N/A - Designed for pressure-fit contact within a SIM card slot.
Chain & Links
N/A - Flat contact pads only.
Craftsmanship Details
Precision photolithography and industrial electroplating designed for high-volume automated production.
Authentication Indicators
Coloration consistent with hard-gold electroplating; signature 6-contact or 8-contact geometric pattern used in smart cards.
Origin & Maker
Likely manufactured by a semiconductor firm (e.g., Giesecke+Devrient, Gemalto/Thales, or IDEMIA).
Era & Period
Contemporary (Information Age, 1990s-Present).
Age Estimate
Modern (last 5-10 years based on contact layout).
Cultural Significance
Represents the global shift toward digital assets and mobile connectivity; a symbol of the 'E-waste' environmental challenge.
Condition Notes
Fair. Significant surface wear, particulate debris, and signs of adhesive or environmental degradation. Functional integrity is likely compromised.
Value Estimate
Negligible. Melt value is less than $0.05 USD. Requires thousands of units to achieve significant refining yield.
Care & Maintenance
Not applicable for jewelry standards; requires specialized chemical refining (aqua regia or cyanide stripping) to recover gold value.
Similar Items
Credit card EMV chips, CPU pins, gold-plated RAM fingers, and circuit board headers.
Interesting Facts
Gold is used in electronics because it is highly conductive and, unlike silver or copper, does not tarnish or oxidize, ensuring a reliable connection for years.