Electronic Printed Circuit Board Component with Gold Wire Bonding

Raw Gold / E-Waste Scrap (Microchip Component) · Yellow Gold (Micro-fine bonding wire and plating traces)

Purity: Trace/Variable (Typically 99.9% fine gold wire bonding, very small total mass)

Electronic Printed Circuit Board Component with Gold Wire Bonding

Type

Raw Gold / E-Waste Scrap (Microchip Component)

Purity

Trace/Variable (Typically 99.9% fine gold wire bonding, very small total mass)

Gold Type

Yellow Gold (Micro-fine bonding wire and plating traces)

Weight

Fraction of a gram of recoverable precious metals per piece

Description

A fragmented piece of printed circuit board featuring visible micro-electronic pathways, contact pads, and microchip die attachment areas. While it contains microscopic amounts of gold used for high-conductivity wire bonding and pin plating, it is classified as e-waste scrap rather than jewelry or bullion.

Key Features

Intricate micro-traces, square central die area, gold wire bonding pads, green fiberglass base

Color & Finish

Green fiberglass substrate with metallic gold traces and bonding pads

Hallmarks & Stamps

None applicable (industrial electronic component markings only)

Dimensions Estimate

Approximately 1 inch by 1 inch square fragment

Gemstones & Inlays

None, contains silicon die and substrate materials

Clasp & Closure

None applicable

Chain & Links

None applicable

Craftsmanship Details

Precision micro-lithography and automated wire bonding typical of semiconductor manufacturing

Authentication Indicators

Visual inspection shows typical micro-circuitry layouts; actual gold content requires destructive refining or XRF analysis

Origin & Maker

Generic electronic manufacturing (computer, smartphone, or processor scrap)

Era & Period

Contemporary / Late 20th to Early 21st Century

Age Estimate

Circa 1990s-2010s production

Cultural Significance

Represents the modern digital age, technological advancement, and the growing economic importance of urban mining and electronic recycling.

Condition Notes

Damaged, fragmented, and broken industrial scrap with physical wear and oxidation

Value Estimate

Nominal scrap value based strictly on the microscopic quantity of recoverable precious metals (pennies per piece unless processed in bulk)

Care & Maintenance

Requires safe handling due to potential exposure to heavy metals or sharp fiberglass edges; store dry if collecting for scrap

Similar Items

Computer CPU chips, RAM sticks, gold-plated connector pins, and mobile phone logic boards

Interesting Facts

Millions of tons of electronic waste are discarded annually, containing billions of dollars in recoverable gold, silver, and palladium, often making e-waste richer in gold per ton than mined ore.

Identified on 9/19/2026