Gold-Plated Flex Circuit Board Connector Contacts
Electronic Component with Gold Plating · Yellow Gold Electroplate
Purity: Gold Plating / Flash Gold (Estimated <0.1% pure gold by weight)
Type
Electronic Component with Gold Plating
Purity
Gold Plating / Flash Gold (Estimated <0.1% pure gold by weight)
Gold Type
Yellow Gold Electroplate
Weight
Extremely low weight, typically fractions of a gram of gold per pound of scrap electronic components
Description
This item is a flexible printed circuit (FPC) board featuring gold-plated edge connector contacts. While not a piece of fine jewelry or bullion, the micro-thin layer of electroplated gold serves a crucial industrial purpose, providing a highly conductive, corrosion-resistant interface for electronic data transmission.
Key Features
Microscopic thickness of gold electroplating, fine parallel contact fingers designed for insertion into zero insertion force (ZIF) connectors, flexible polymer substrate
Color & Finish
Bright, reflective yellow gold finish on the edge connector fingers contrasting with pink printed circuit traces and white substrate
Hallmarks & Stamps
No traditional precious metal hallmarks; contains manufacturer alphanumeric codes such as 'Date Code 4504'
Dimensions Estimate
Small component part, approximately several centimeters in width with micro-thin gold contact fingers
Gemstones & Inlays
None
Clasp & Closure
None
Chain & Links
None
Craftsmanship Details
Precision industrial photolithography and electroplating used to deposit micro-thin layers of gold onto specific contact pads for optimal electrical performance
Authentication Indicators
Bright metallic luster on contact fingers matching standard industrial gold plating over a copper trace substrate; lacks standard jewelry stamps
Origin & Maker
Generic consumer electronics manufacturer
Era & Period
Contemporary (Modern electronic era)
Age Estimate
Likely manufactured in the 2000s to present day based on the flex circuit technology and date code format
Cultural Significance
Represents the modern intersection of precious metals and high technology, where gold's functional properties in computing and telecommunications outweigh its traditional ornamental value
Condition Notes
Used electronic scrap condition with visible handling wear, creasing of the flexible substrate, and potential separation from a larger device assembly
Value Estimate
Nominal scrap value based strictly on the microscopic recoverable gold content through specialized e-waste refining processes
Care & Maintenance
Not applicable for traditional care; sensitive to harsh chemicals, bending, and physical abrasion which can wear away the microscopic gold layer
Similar Items
Gold-plated CPU pins, RAM stick connector edges, SIM card contacts, and gold wire bonds inside semiconductor packages
Interesting Facts
Millions of electronic devices rely on microscopic quantities of gold for its superior electrical conductivity and resistance to oxidation, making e-waste recycling a significant secondary source of gold recovery